# Micron Technology, Inc. (NASDAQ:MU)

> Micron Technology, founded in 1978, is a leading semiconductor company specializing in memory and storage solutions.

## About

Micron Technology, founded in 1978, is a leading semiconductor company specializing in memory and storage solutions. The company has grown from a small design firm to a global leader in the industry, known for its innovative technologies and significant contributions to the semiconductor market, including advancements in DRAM and NAND flash memory.

## Key facts

- **Cash position:** $30.2 billion
- **Shares outstanding:** 1,127,734,051
- **Projects:** ["Micron Completes Acquisition of PSMC’s Tongluo P5 Site in Taiwan\nMarch 15, 2026\n- English(opens in new window)\n- Chinese Traditional(opens in new window)\n\nExisting cleanroom retrofit to begin in March with plans to begin construction of a similar-sized second cleanroom at this site by the end of fiscal 2026\n\nBOISE, Idaho, March 15, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) today announced it has completed the acquisition and assumed ownership of Powerchip Semiconductor Manufacturing Corporation’s (PSMC) P5 site in Tongluo, Miaoli County, Taiwan, under the acquisition agreement previously announced on January 17, 2026.\n\nThe new site will complement Micron’s existing operations in Taiwan as an extension of the company’s vertically integrated mega campus in Taichung, located approximately 15 miles away. The site includes approximately 300,000 square feet of existing 300mm cleanroom space and will support Micron’s efforts to expand supply of leading-edge DRAM products, including HBM, to meet growing AI-driven demand.\n\nMicron began preparations for the new Tongluo site following the deal announcement in January 2026 and will begin retrofitting the existing cleanroom now that the transaction has been completed. The new Tongluo site is expected to support meaningful product shipments from the existing fab beginning in fiscal 2028. The company is also planning the next phase of expansion at the site, with construction set to begin by the end of fiscal 2026 on a second facility of comparable scale, adding approximately 270,000 square feet of cleanroom space.\n\n“The Tongluo facility complements our Taiwan operations and is a critical component of our global expansion plans,” said Manish Bhatia, executive vice president of global operations at Micron Technology. “Memory is a strategic asset that dictates AI product performance, and the acquisition and phased ramp of this site strengthens our ability to capitalize on these significant opportunities. We appreciate the strong collaboration from the Taiwan government, our construction partners, and equipment and materials suppliers to enable and accelerate the ramp of our production capacity at this site.”\n\nMicron thanks PSMC, the Taiwan central government, including the Ministry of Economic Affairs, National Science and Technology Council, and Hsinchu Science Park, as well as Miaoli County Government, for their strong support, collaboration to ensure a swift and successful acquisition process, and commitment in enabling the new site, leveraging the efficiency and speed of execution fueled by the world-class semiconductor manufacturing ecosystem in Taiwan.","Micron Announces Groundbreaking for Historic New York Megafab\nJanuary 7, 2026\n- English(opens in new window)\n\nMarking the start of construction on the largest semiconductor manufacturing facility in U.S. history, Micron executives to join federal, state and local leaders to celebrate the $100 billion project in Central New York\n\nSYRACUSE, N.Y., Jan. 07, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) today announced that on Jan. 16, 2026, it will officially break ground on its megafab in Onondaga County, New York. Following rigorous environmental review and necessary permit approvals, Micron is now positioned to begin ground preparation and construction at the site.\n\nMarking the largest private investment in New York state history, the project will be home to the most advanced memory manufacturing in the world and will help meet the growing demands of the AI systems that are central to the modern economy. With up to four fabs, this will be the largest semiconductor facility in the United States.\n\nMicron Chairman, President and CEO Sanjay Mehrotra and other top executives will join with officials from the Trump administration, Congress and New York state and local government, as well as distinguished business leaders and members of the community, to celebrate this major step together. The groundbreaking ceremony will be followed by a celebration program at Syracuse University’s National Veterans Resource Center where executives and officials will provide remarks.\n\n“Breaking ground at Micron’s New York megafab is a pivotal moment for Micron and the United States,” said Sanjay Mehrotra, Chairman, President and CEO of Micron Technology. “I want to thank President Trump, Secretary Lutnick, Administrator Zeldin, Governor Hochul, Senator Schumer, Congressman Mannion, Congresswoman Tenney, County Executive McMahon and all of our partners in the Administration and Congress for their leadership and partnership in getting to this milestone. As the global economy enters the AI era, leadership in advanced semiconductors will be the cornerstone in innovation and economic prosperity. Our investments and progress solidify our position as the only United States manufacturer of memory.","Micron Breaks Ground on Advanced Wafer Fabrication Facility in Singapore\nJanuary 26, 2026\n- English(opens in new window)\n\nApproximately $24 billion investment over 10 years will support long-term manufacturing requirements and AI-driven demand\n\nSINGAPORE, Jan. 27, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on an advanced wafer fabrication facility located within the company's existing NAND manufacturing complex in Singapore. This new facility represents a planned investment of approximately US $24 billion (SG $31 billion) over 10 years and is designed to ultimately provide 700,000 square feet of cleanroom space. Wafer output is scheduled to begin in the second half of calendar 2028, helping Micron address growing market demand for NAND technology driven by the rapid expansion of AI and data-centric applications.\n\nThe groundbreaking ceremony for this facility, Singapore’s first double-story wafer manufacturing fab, was marked by the attendance of Gan Kim Yong, deputy prime minister and minister for Trade and Industry of Singapore, Dr Beh Swan Gin, permanent secretary of the Ministry of Trade and Industry, Jermaine Loy, managing director of the Singapore Economic Development Board (EDB) and Jacqueline Poh, CEO of JTC Corporation.\n\n“Micron’s leadership in advanced memory and storage is enabling the AI-driven transformation reshaping the global economy,” said Manish Bhatia, executive vice president of global operations at Micron Technology. “We are grateful for the longstanding support and successful partnership with the Singapore government, including EDB and JTC. This investment underscores Micron’s long-term commitment to Singapore as an important hub in our global manufacturing network, enhancing supply chain resiliency and fostering a vibrant ecosystem for innovation.”\n\nThis new fab will become an integral part of Micron’s NAND Center of Excellence in Singapore. The facility provides the essential capacity to support continued technology transitions, positioning Micron to meet long-term demand for advanced storage solutions. Additionally, co-locating R&D with manufacturing improves efficiencies, accelerates time-to-market and deepens research partnerships between industry and academia.\n\nMicron’s previously announced high-bandwidth memory (HBM) advanced packaging facility, also located in the same Singapore manufacturing complex, is on track to contribute meaningfully to Micron’s HBM supply in calendar year 2027. As HBM becomes a part of Micron’s Singapore manufacturing footprint, the company expects opportunities for synergies between NAND and DRAM production. Micron will maintain flexibility in managing the pace of capacity ramps in the new facility to align with market demand.\n\nMicron’s advanced wafer fabrication facility investment will create around 1,600 jobs. Combined with the previously announced 1,400 jobs from the HBM advanced packaging facility, Micron’s expansion will support about 3,000 new Micron jobs total. These positions will focus on fab engineering and operations, integrating AI, advanced robotics and smart manufacturing technologies to enhance efficiency and innovation.\n\n“Micron’s latest expansion will strengthen our semiconductor ecosystem and further anchor Singapore as a critical node in the global semiconductor supply chain,” said Jermaine Loy, managing director of the Singapore EDB. “This investment rides on growth in AI and will provide good jobs for Singaporeans. Micron’s advanced facility will leverage advanced robotic automation and boost our advanced manufacturing ecosystem, helping our workforce seize new opportunities.”\n\nThe fab will comply with the company’s sustainability commitments and build on the site’s recognition as both a World Economic Forum Sustainability Lighthouse and an Energy Efficiency National Partnership (EENP) Award recipient. The fab will also adhere to LEED standards, such as greenhouse gas abatement, water recycling and waste circularity.\n\nIn collaboration with academia and ecosystem partners, Micron's investment creates opportunities to build a future-ready semiconductor workforce through multiple pathways, offering real-world learning experiences such as internships for students, upskilling the current workforce in AI and smart manufacturing, and advancing R&D talent development to drive future innovation."]
- **Leadership:** Sanjay Mehrotra (President and CEO, Co-founder of SanDisk, served as its president and CEO from 2011 to 2016, driving significant growth and innovation in the memory and storage industry.)

_Verified data last updated: 2026-08-14_

## Recent filings

- 2026-07-28 — other — [mu_2026-07-28_22-20-06.pdf](https://ai-chat-dev-red.vercel.app/mu/preview/98293?documentId=98293)
- 2026-07-28 — other — [mu_2026-07-28_22-19-14.pdf](https://ai-chat-dev-red.vercel.app/mu/preview/98294?documentId=98294)
- 2026-07-27 — other — [mu_2026-07-27_22-30-17.pdf](https://ai-chat-dev-red.vercel.app/mu/preview/97332?documentId=97332)
- 2026-07-24 — other — [mu_2026-07-24_19-04-25.pdf](https://ai-chat-dev-red.vercel.app/mu/preview/91630?documentId=91630)
- 2026-07-23 — other — [mu_2026-07-23_19-02-07.pdf](https://ai-chat-dev-red.vercel.app/mu/preview/90457?documentId=90457)
- 2026-07-17 — other — [mu_2026-07-17_21-57-15.pdf](https://ai-chat-dev-red.vercel.app/mu/preview/77892?documentId=77892)
- 2026-07-06 — other — [mu_2026-07-06_22-06-03.pdf](https://ai-chat-dev-red.vercel.app/mu/preview/63830?documentId=63830)
- 2026-07-02 — other — [mu_2026-07-02_22-08-48.pdf](https://ai-chat-dev-red.vercel.app/mu/preview/63831?documentId=63831)

## Live AI chat

- https://ai-chat-dev-red.vercel.app/mu/chat
- Investor website: https://micron.com/